Thermosets Hard at Work in your Mobile PhonePresenter: Jeffrey Gotro, Ph.D., InnoCentrix, LLCAbstractAbstract Authors: You might not think that thermoset chemistry and processing is a key part of the manufacturing of electronic devices, but without sophisticated thermosetting polymers and advanced processing techniques, today’s electronic devices would not be possible. There are a wide variety of thermoset polymers used in the typical smart phone. These include epoxy resins for high density circuit boards, adhesives to attach semiconductor chips to substrates, underfills to stabilize soldered chips, and encapsulants. The presentation will provide an overview of the formulation challenges when developing thermosets used in smart phone applications. Some of the thermoset chemistries used in include epoxies, acrylics, bismaleimides, cyanate esters and UV cured thermosets. Processing methods such as adhesive and underfill dispensing as well as lamination for multilayer circuit boards will be covered. Emphasis will be placed on the structure- property-processing relationships required to make mobile devices highly reliable. About Jeffrey Gotro Jeff authored a chapter in the Encyclopedia of Polymer Science & Technology on Thermosets in 2017. Jeff holds 15 issued US Patents and has 5 patent applications currently filed and pending in the United States Patent and Trademark Office. Jeff has published over 50 papers and four book chapters in technical journals and conference proceedings. Jeff has a Bachelor of Science in Mechanical Engineering and Materials Science from Marquette University and a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science (polymer chemistry, physics, and characterization). |
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